Package structures including discrete antennas assembled on a device

ABSTRACT

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a package structure comprising a discrete antenna disposed on a back side of a device, wherein the discrete antenna comprises an antenna substrate, a through antenna substrate via vertically disposed through the antenna substrate. A through device substrate via that is vertically disposed within the device is coupled with the through antenna substrate via, and a package substrate is coupled with an active side of the device.

This is a Continuation application of Ser. No. 13/721,245 filed Dec. 20,2012, which is presently pending.

BACK GROUND OF THE INVENTION

The integration of millimeter wave radios operating at 30 GHz or aboveon platforms allows for the wireless transfer of data between devices orbetween chips. The successful transfer of data between the devices/chipsrequires one or more package-level integrated antennas that serve as aninterface. Applications such as ultra-short range chip-to-chipcommunications and post silicon validation of system on achip(SoC)/central processing unit (CPU) devices using wireless debugports may suffer from routing losses and loss of package real estateassociated with traditional/prior art in package substrate/antenna arraydesigns.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming certain embodiments, the advantages of theseembodiments can be more readily ascertained from the followingdescription of the invention when read in conjunction with theaccompanying drawings in which:

FIGS. 1a-1d represent structures according to various embodiments.

FIG. 2 represents a flow chart according to embodiments.

FIG. 3 represents structures according to embodiments.

FIG. 4 represents a system according to embodiments.

DETAILED DESCRIPTION OF THE PRESENT INVENTION

In the following detailed description, reference is made to theaccompanying drawings that show, by way of illustration, specificembodiments in which the methods and structures may be practiced. Theseembodiments are described in sufficient detail to enable those skilledin the art to practice the embodiments. It is to be understood that thevarious embodiments, although different, are not necessarily mutuallyexclusive. For example, a particular feature, structure, orcharacteristic described herein, in connection with one embodiment, maybe implemented within other embodiments without departing from thespirit and scope of the embodiments. In addition, it is to be understoodthat the location or arrangement of individual elements within eachdisclosed embodiment may be modified without departing from the spiritand scope of the embodiments. The following detailed description is,therefore, not to be taken in a limiting sense, and the scope of theembodiments is defined only by the appended claims, appropriatelyinterpreted, along with the full range of equivalents to which theclaims are entitled. In the drawings, like numerals may refer to thesame or similar functionality throughout the several views.

Methods of forming and utilizing microelectronic package structures,such as forming a package structure including discrete antenna disposedon a top surface of a microelectronic device, are described. Thosemethods and structures may include forming a package structurecomprising a discrete antenna disposed on a back side of a device,wherein the discrete antenna comprises an antenna substrate, a throughantenna substrate via vertically disposed through the antenna substrate.A through substrate via that is vertically disposed within the devicemay be coupled with the through antenna substrate via, and a packagesubstrate may be coupled with an active side of the device. The packagestructures of the various embodiments disclosed herein enable the use ofdiscrete individual antennas for shorter range transmissionapplications.

FIGS. 1a-1d illustrate embodiments of package structures including atleast one discrete antenna disposed on a device. In an embodiment, apackage structure 100 comprises at least one discrete antenna 102 (FIG.1a ). The discrete antenna 102 comprises an antenna substrate 104, whichmay comprise a glass material in some embodiments. In other embodiments,the antenna substrate 104 may comprise at least one of a liquid crystalpolymer, an organic material, a low temperature co-fired ceramic,alumina, an undoped silicon, and any high performance, millimeter wavesubstrate, depending upon the particular application. In an embodiment,the antenna substrate 104 comprises a frequency of about 30 GHz andabove. In an embodiment, the antenna substrate 104 may comprisealternating layers of conductive material and dielectric material. In anembodiment, the discrete antenna 102 may comprise a high k dielectricmaterial, which may serve to reduce the dimensions of the discreteantenna 102, in some cases. In an embodiment, the discrete antenna 102may comprise a radiating element 106 and a through antenna substrate via108. In an embodiment, the radiating element 106 may comprise multiplelevels of metals that may be capacitavely coupled to each other (forexample, the radiating element may comprise a plurality of metal layersseparated by dielectric material) to enhance the frequency bandwidth ofthe discrete antenna 102.

In an embodiment, the radiating element 106 may be horizontally disposedon a top portion of the antenna substrate 104, and may beperpendicularly coupled with the through antenna substrate via 108. Inan embodiment, the discrete antenna 102 may comprise dimensions that maybe less than about 2 mm in width, less than about 2 mm in length andless than about 0.4 mm in height. The dimensions of the discrete antenna102 may vary depending upon the particular application. In anembodiment, the physical dimensions of the antenna substrate 104 may bemuch less than the wavelength of the frequency range within which thedevice/application is capable of operating. In an embodiment, thethrough antenna substrate via 108 may not be physically coupled to theradiating element 106, wherein a milliwave-wave signal may beelectromagnetically coupled between the radiating element 106 and athrough substrate via 116.

The through antenna substrate via 108 may be vertically disposed withinthe antenna substrate 104. An antenna contact 110 may be coupled withthe through antenna substrate via 108, and may be disposed on a bottomportion of the antenna substrate 104. An antenna conductive structure112 may be coupled with the antenna contact 110. A device contact 114,which may comprise a redistribution layer (RDL) 114, may be coupled withthe antenna conductive structure 112. The device contact 114 may bedisposed on a backside of a device 118. The device 118 may comprise asystem on chip (SoC) device comprising a radio 119, such as a millimeterwave radio, in an embodiment, and may comprise any type of devicesuitable for a particular application, in other embodiments.

A through device substrate via, which may comprise a through substratevia (TSV) 116 may be coupled with the device contact 114, and may bevertically disposed within the device/device substrate 118. In anembodiment, the through substrate via 116 may be lined with an insulatormaterial 121, such as silicon oxide, for example (FIG. 1d , depicting aportion of the device 118 comprising the TSV 116). The through substratevia 116 lined with the insulator 121 may be disposed through a devicematerial 135, which may comprise a silicon substrate material 135 insome cases, and the device 118 may exhibit losses of less than 1 dB inembodiments. The device material 135 may be insulated from the devicecontact 114 and an active layer/side 120 of the device 118 by aninsulating material 137 such as an oxide material, for example.

Referring back to FIG. 1a , the through substrate via 116 may beelectrically and physically coupled with the through antenna substratevia 108 (with antenna contact 110, the conductive structure 112 and thedevice contact 114 coupling in between), wherein the through antennasubstrate via 108 coupled with the through substrate via 116 may conducta signal from the discrete antenna 102 to the device 118. In anotherembodiment, the through antenna substrate via 108 may be coupled to thethrough substrate via 116 by one of a conductive structure and metal tometal bonding. In an embodiment, the discrete antenna 102 may comprise ahigh performance millimeter wave antenna substrate 104 such as glass.The millimeter wave signal that is capable of being emitted/propagatedfrom the radiating element 106 in/on the antenna substrate 104 may betransmitted/propagated between the discrete antenna 102 and the device118 by the coupling between the through antenna substrate via 108 andthe through substrate via 116.

A ground antenna contact 111 may be disposed on the bottom portion ofthe antenna substrate 104, adjacent the antenna contact 110. A groundantenna conductive structure 113 may be coupled with the ground antennacontact 111. A ground device contact 115 may be coupled with the groundantenna conductive structure 113. The ground device contact 115 may bedisposed on a backside of the device 118. A ground through devicesubstrate via 117, which may comprise a ground through substrate via117, may be coupled with the ground device contact 115, and may bevertically disposed within the device 118. The ground through devicesubstrate via 117 may be adjacent to the signal through substrate via116, and may provide ground referencing to the discrete antenna 102.

In an embodiment, a second discrete antenna 102′ may be disposed on thedevice 118 and may be adjacent to the discrete antenna 102. The seconddiscrete antenna 102′ comprises an antenna substrate 104′, and maycomprise similar materials as the antenna substrate 104. The seconddiscrete antenna 102′ may comprise a radiating element 106′ coupled to athrough antenna substrate via 108′, an antenna contact 110′ coupled withthe through antenna substrate via 108′, and an antenna conductivestructure 112′ coupled with the antenna contact 110′.

A device contact 114′ may be coupled with the antenna conductivestructure 112′. The device contact 114′ may be disposed on a backside ofthe device 118. A through device substrate via 116′ may be coupled withthe device contact 114′, and may be vertically disposed within thedevice 118. The through device substrate via 116′ may be electricallyand physically coupled with the through antenna substrate via 108′.

A ground antenna contact 111′ may be disposed on the bottom portion ofthe antenna substrate 104′, adjacent the antenna contact 110′. A groundantenna conductive structure 113′ may be coupled with the ground antennacontact 111′. A ground device contact 115′ may be coupled with theground antenna conductive structure 113′. The ground device contact 115′may be disposed on a backside of the device 118. A ground throughsubstrate via 117′, which may comprise a ground through device substratevia 117′, may be coupled with the ground device contact 115′, and may bevertically disposed within the device 118. The ground through substratevia 117′ may be adjacent to the signal through substrate via 116′, andmay ground reference to the second discrete antenna 102′.

The discrete antennas 102, 102′ may be assembled/coupled with the backside of the device 118. In an embodiment, a millimeter wave signal thatmay be induced between the device and the discrete antennas 102, 102′ bythe radiating elements 106, 106′ may be carried by a series connectionbetween the signal through the substrate vias 116, 116′ and the throughantenna substrate vias 108, 108′. Additionally, each of the signal vias(which may comprise the series connection between the through thesubstrate vias 116, 116′ and the through antenna substrate vias 108,108′) may be surrounded by one or multiple ground through substrate vias117, 117′, depending upon the particular application. The ground throughsubstrate vias 117, 117′ serve as a return path for the millimeter wavesignal from the discrete antennas 102, 102′.

The discrete antennas 102, 102′ exhibit greatly improved electricalproperties as compared with antennas implemented within a packagesubstrate. In addition, the vertical implementation of the TSV's coupledwith the vertical through antenna substrate vias frees up package spaceneeded for traditional CPU signal routing, for example, and henceimproves the overall compactness of the package structure 100.

In an embodiment, the active side/layer 120 of the device 118 may becoupled with a substrate 126 by solder balls/interconnects 122. Inanother embodiment, the active side 120 of the device 118 may be coupledwith the substrate 126 by direct metal to metal bonding. In anembodiment, the package structure 100 may comprise a 3D packagestructure 100. In an embodiment, the package structure 100 may comprisea portion of a coreless, bumpless build up layer (BBUL) packagestructure 100. In another embodiment, the portion of the packagestructure 100 may comprise any suitable type of package structure 100capable of providing electrical communications between a microelectronicdevice(s), such as the devices 102, 102′102″, and a next-level componentto which the package structure 100 may be coupled (e.g., a circuitboard). In another embodiment, the package structures 100 herein maycomprise any suitable type of package structures capable of providingelectrical communication between a die and an upper integrated circuit(IC) package coupled with a lower IC package.

The substrate 126 of the embodiments herein may comprise a multi-layersubstrate 126, including alternating layers of a dielectric material andmetal built-up around a core layer (either a dielectric or metal core).In another embodiment, the substrate 126 may comprise a corelessmulti-layer substrate 126. Other types of substrates and substratematerials may also find use with the disclosed embodiments (e.g.,ceramics, sapphire, glass, etc.).

In an embodiment, the device package structure 100 comprises the device118 including the millimeter wave radio 119, that may be flip-chipassembled on a multilayer package substrate 126. In another embodiment,a plurality of discrete chip antennas 102 may be formed/coupled on thedevice 118, wherein the number of discrete antennas 102 coupled with thedevice 118 may depend upon the particular design requirements. Thediscrete antennas 102 of the embodiments herein occupy less area on thepackage substrate 126, and exhibit a significant decrease in signalloss. Additionally, the embodiments require less stringent signalisolation solution, leading to a decrease of package footprint.

FIG. 1b depicts an embodiment wherein the device 118 (similar to thedevice 118 and associated package 100 components depicted in FIG. 1a )may be partially embedded in a coreless substrate 127, such as a BBULsubstrate 127, for example. Interconnects 122 may be disposed within thesubstrate 127 and may be coupled with coreless interconnect structures124. In an embodiment, the package structure 131 may comprise at leasttwo discrete antennas 102, 102′. An advantage of forming/coupling thedevice 118 and discrete antennas 102, 102′ in a partially embeddedsubstrate 127 is an overall Z-height reduction of the package structure131. In another embodiment, the device 118 and antennas 102, 102′ may befully embedded in the substrate 127.

FIG. 1c depicts an embodiment wherein a package structure 132 comprisestwo devices 118, 118′ (similar to the device 118 and associated package100 components of FIG. 1a ) stacked upon one another. The firstdevice/die 118 may be coupled with/disposed on the package substrate126, which may comprise any type of suitable package substrate 126, andthe second device/die 118′ may be disposed/stacked on the first device118. The first device 118 may be coupled with the second device 118′ byground vias 117′ and signal vias 116′, as well as by ground interconnectstructures 123 and signal interconnect structures 125. In an embodiment,the discrete antenna 102 (similar to the discrete antenna of FIG. 1a ),may comprise a dimension as small as 1 mm in width and 1 mm in length,and may be stacked on the first device 118 adjacent the second device118′. In general, the dimensions of the discrete antenna of theembodiments comprise a fraction of the minimum wavelength in thefrequency range of a particular application/design.

In an embodiment, the package structure 132 may comprise a system onchip including at least one 3D stacked millimeter wave chip antenna. Insome embodiments, a plurality of discrete antennas may be placed/coupledwith a backside of the first device 118. In an embodiment, an optionalradio frequency interference (RFI) shield 130 may be disposed around/maysurround the stacked devices 118, 118′. In some embodiments, the RFIshield may be used to further isolate the discrete antenna (s) from therest of the package structure components.

The embodiments herein include enablement of 3D integration of discreteantenna with package structures, wherein one or multiple discretemillimeter wave chip antennas are assembled on top of a main system onchip/CPU die/device, wherein the device comprises an integrated mm-waveradio. The antennas may be implemented on high performance millimeterwave substrates, such as glass for example, wherein the millimeter wavesignal may be coupled between the discrete antenna and the device usingthrough substrate vias. The embodiments herein support integration ofthe 3D discrete antennas into such applications as ultra-short rangechip-to-chip communication and post silicon validation of SoC/CPU chipsusing a wireless debug port, for example. Applications such as wirelesssignal to logic analyzer, and wireless multiple antenna transmissionbetween devices, such as between mobile devices and/or between suchdevices as DVD and display devices, for example, are enabled herein.

In another embodiment, a method of forming a package structure isdepicted in FIG. 2. At step 202, at least one discrete antenna is formedon a back side of a device, wherein the discrete antenna comprises anantenna substrate. At step 204, a through antenna substrate via isformed through the antenna substrate, wherein the through the throughantenna substrate via is vertically disposed through the antennasubstrate. At step 206, the through antenna substrate via is coupledwith a through substrate via that is vertically disposed within thedevice, and At step 208, the device is coupled with a package substrate.

Turning now to FIG. 3, illustrated is an embodiment of a computingsystem 300. The system 300 includes a number of components disposed on amainboard 310 or other circuit board. Mainboard 310 includes a firstside 312 and an opposing second side 314, and various components may bedisposed on either one or both of the first and second sides 312, 314.In the illustrated embodiment, the computing system 300 includes apackage structure 340 (which may be similar to the package structure 100of FIG. 1a , for example) disposed on the mainboard's first side 312,wherein the package structure 340 may comprise any of the microchannelstructure embodiments described herein.

System 300 may comprise any type of computing system, such as, forexample, a hand-held or mobile computing device (e.g., a cell phone, asmart phone, a mobile internet device, a music player, a tabletcomputer, a laptop computer, a nettop computer, etc.). However, thedisclosed embodiments are not limited to hand-held and other mobilecomputing devices and these embodiments may find application in othertypes of computing systems, such as desk-top computers and servers.

Mainboard 310 may comprise any suitable type of circuit board or othersubstrate capable of providing electrical communication between one ormore of the various components disposed on the board. In one embodiment,for example, the mainboard 310 comprises a printed circuit board (PCB)comprising multiple metal layers separated from one another by a layerof dielectric material and interconnected by electrically conductivevias. Any one or more of the metal layers may be formed in a desiredcircuit pattern to route—perhaps in conjunction with other metallayers—electrical signals between the components coupled with the board310. However, it should be understood that the disclosed embodiments arenot limited to the above-described PCB and, further, that mainboard 310may comprise any other suitable substrate.

In addition to the package structure 340, one or more additionalcomponents may be disposed on either one or both sides 312, 314 of themainboard 310. By way of example, as shown in the figures, components301 a may be disposed on the first side 312 of the mainboard 310, andcomponents 301 b may be disposed on the mainboard's opposing side 314.Additional components that may be disposed on the mainboard 310 includeother IC devices (e.g., processing devices, memory devices, signalprocessing devices, wireless communication devices, graphics controllersand/or drivers, audio processors and/or controllers, etc.), powerdelivery components (e.g., a voltage regulator and/or other powermanagement devices, a power supply such as a battery, and/or passivedevices such as a capacitor), and one or more user interface devices(e.g., an audio input device, an audio output device, a keypad or otherdata entry device such as a touch screen display, and/or a graphicsdisplay, etc.), as well as any combination of these and/or otherdevices.

In one embodiment, the computing system 300 includes a radiation shield.In a further embodiment, the computing system 300 includes a coolingsolution. In yet another embodiment, the computing system 300 includesan antenna. In yet a further embodiment, the assembly 300 may bedisposed within a housing or case. Where the mainboard 310 is disposedwithin a housing, some of the components of computer system 300—e.g., auser interface device, such as a display or keypad, and/or a powersupply, such as a battery—may be electrically coupled with the mainboard310 (and/or a component disposed on this board) but may be mechanicallycoupled with the housing.

FIG. 4 is a schematic of a computer system 400 according to anembodiment. The computer system 400 (also referred to as the electronicsystem 400) as depicted can embody/include a package structure thatincludes any of the several disclosed embodiments and their equivalentsas set forth in this disclosure. The computer system 400 may be a mobiledevice such as a netbook computer. The computer system 400 may be amobile device such as a wireless smart phone. The computer system 400may be a desktop computer. The computer system 400 may be a hand-heldreader. The computer system 400 may be integral to an automobile. Thecomputer system 400 may be integral to a television.

In an embodiment, the electronic system 400 is a computer system thatincludes a system bus 420 to electrically couple the various componentsof the electronic system 400. The system bus 420 is a single bus or anycombination of busses according to various embodiments. The electronicsystem 400 includes a voltage source 430 that provides power to theintegrated circuit 410. In some embodiments, the voltage source 430supplies current to the integrated circuit 410 through the system bus420.

The integrated circuit 410 is electrically, communicatively coupled tothe system bus 420 and includes any circuit, or combination of circuitsaccording to an embodiment, including the package/device of the variousembodiments included herein. In an embodiment, the integrated circuit410 includes a processor 412 that can include any type of packagingstructures according to the embodiments herein. As used herein, theprocessor 412 may mean any type of circuit such as, but not limited to,a microprocessor, a microcontroller, a graphics processor, a digitalsignal processor, or another processor. In an embodiment, the processor412 includes any of the embodiments of the package structures disclosedherein. In an embodiment, SRAM embodiments are found in memory caches ofthe processor.

Other types of circuits that can be included in the integrated circuit410 are a custom circuit or an application-specific integrated circuit(ASIC), such as a communications circuit 414 for use in wireless devicessuch as cellular telephones, smart phones, pagers, portable computers,two-way radios, and similar electronic systems. In an embodiment, theprocessor 412 includes on-die memory 416 such as static random-accessmemory (SRAM). In an embodiment, the processor 412 includes embeddedon-die memory 416 such as embedded dynamic random-access memory (eDRAM).

In an embodiment, the integrated circuit 410 is complemented with asubsequent integrated circuit 411. In an embodiment, the dual integratedcircuit 411 includes embedded on-die memory 417 such as eDRAM. The dualintegrated circuit 411 includes an RFIC dual processor 413 and a dualcommunications circuit 415 and dual on-die memory 417 such as SRAM. Thedual communications circuit 415 may be configured for RF processing.

At least one passive device 480 is coupled to the subsequent integratedcircuit 411. In an embodiment, the electronic system 400 also includesan external memory 440 that in turn may include one or more memoryelements suitable to the particular application, such as a main memory442 in the form of RAM, one or more hard drives 444, and/or one or moredrives that handle removable media 446, such as diskettes, compact disks(CDs), digital variable disks (DVDs), flash memory drives, and otherremovable media known in the art. The external memory 440 may also beembedded memory 448. In an embodiment, the electronic system 400 alsoincludes a display device 450, and an audio output 460. In anembodiment, the electronic system 400 includes an input device such as acontroller 470 that may be a keyboard, mouse, touch pad, keypad,trackball, game controller, microphone, voice-recognition device, or anyother input device that inputs information into the electronic system400. In an embodiment, an input device 470 includes a camera. In anembodiment, an input device 470 includes a digital sound recorder. In anembodiment, an input device 470 includes a camera and a digital soundrecorder.

Although the foregoing description has specified certain steps andmaterials that may be used in the methods of the embodiments, thoseskilled in the art will appreciate that many modifications andsubstitutions may be made. Accordingly, it is intended that all suchmodifications, alterations, substitutions and additions be considered tofall within the spirit and scope of the embodiments as defined by theappended claims. In addition, the Figures provided herein illustrateonly portions of exemplary microelectronic devices and associatedpackage structures that pertain to the practice of the embodiments. Thusthe embodiments are not limited to the structures described herein.

What is claimed is:
 1. A package structure comprising: a discreteantenna disposed on a back side of a first device, wherein the discreteantenna comprises an antenna substrate, wherein the antenna substratecomprises alternating layers of conductive material and dielectricmaterial; a through antenna substrate via, wherein the through antennasubstrate via is vertically disposed through the antenna substrate; athrough substrate via that is vertically disposed within the firstdevice and coupled with the through antenna substrate via; a packagesubstrate coupled with an active side of the first device; and aradiating element perpendicularly coupled with the through antennasubstrate via and disposed on a top portion of the discrete antenna,wherein the radiating element comprises alternating layers of conductivematerial and dielectric material.
 2. The package structure of claim 1,wherein the through antenna substrate via is coupled to the throughsubstrate via by one of a conductive structure and metal to metalbonding.
 3. The package structure of claim 2, wherein the throughantenna substrate via coupled to the through substrate via is capable oftransmitting a millimeter wave signal.
 4. The package structure of claim1, wherein the antenna substrate comprises a frequency of at least about30 GHz.
 5. The package structure of claim 1, further comprising: aground antenna contact disposed on a bottom portion of the discreteantenna.
 6. The package structure of claim 5, wherein the ground antennacontact is coupled to a grounded through substrate via that isvertically disposed in the first device.
 7. The package structure ofclaim 6, wherein the grounded through substrate via is adjacent to thethrough substrate via.
 8. The package structure of claim 1, wherein thefirst device comprises a silicon on chip that comprises a millimeterwave radio.
 9. The package structure of claim 1, wherein an active sideof the first device is coupled with the package substrate by one ofdirect metal to metal bonding and solder bumps.
 10. The packagestructure of claim 1, wherein the package substrate comprises amultilayer package substrate.
 11. The package structure of claim 1,wherein the package substrate comprises a BBUL package substrate, andwherein the first device is partially embedded in the BBUL packagesubstrate.
 12. The package structure of claim 1, wherein the discreteantenna comprises physical dimensions that are less than a frequencyrange within which the device is capable of operating.
 13. The packagestructure of claim 1, further comprising: a plurality of discreteantennas disposed on the first device.
 14. The package structure ofclaim 1, wherein a second device is stacked on the first device.
 15. Thepackage structure of claim 14, further comprising: a radiation shieldthat surrounds the first device and the second device.
 16. The packagestructure of claim 14, wherein the second device comprises a memorydevice.